An improved model considering elastic-plastic contact and partial hydrodynamic lubrication for chemical mechanical polishing

Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology

Volumn 222, Issue 6, 2008, Pages 761-770

  Tsai, H J ^a   Jeng, Y R ^b   Huang, P Y ^a  

^a WUFENG INSTITUTE OF TECHNOLOGY   (Taiwan)

^b NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Chemical mechanical polishing; Elastic plastic contact; Grain flow; Partial hydrodynamic lubrication; Removal rate; Roughness

Indexed keywords

ABS RESINS; CHEMICAL MECHANICAL POLISHING; ELASTOPLASTICITY; FLUID DYNAMICS; GRAIN (AGRICULTURAL PRODUCT); HYDRODYNAMICS; LUBRICATION; MECHANISMS; NANOTECHNOLOGY; PLASTICS; POLISHING;

ELASTIC-PLASTIC CONTACT; GRAIN FLOW; PARTIAL HYDRODYNAMIC LUBRICATION; REMOVAL RATE; ROUGHNESS;

CHEMICAL POLISHING;

EID: 54249117727     PISSN: 13506501     EISSN: None     Source Type: Journal    
DOI: 10.1243/13506501JET407     Document Type: Article

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