Elasto-partial hydrodynamic contact model for chemical mechanical polishing

Journal of the Electrochemical Society

Volumn 153, Issue 12, 2006, Pages

  Tsai, Hung Jung ^a   Jeng, Yeau Ren ^b   Huang, Pay Yau ^a  

^a WUFENG INSTITUTE OF TECHNOLOGY   (Taiwan)

^b NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; LUBRICATION; PARAMETER ESTIMATION; POWDERS; SILICON WAFERS;

DEVICE FABRICATION; FILM THICKNESS; GRAIN FLOW; HYDRODYNAMIC LUBRICATION; HYDRODYNAMIC SLURRY;

HYDRODYNAMICS;

EID: 33750822170     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2359694     Document Type: Article

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