Microfabrication Technology for Millimeter-Wave Photonic Systems on Si

IEEJ Transactions on Sensors and Micromachines

Volumn 124, Issue 4, 2004, Pages 136-142

  Ishii, Hiromu ^a   Minotani, Tadashi ^a   Royter, Yakov ^a,c   Yagi, Shouji ^a   Kudou, Kazuhisa ^b   Yano, Masaki ^b   Nagatsuma, Tadao ^b   Machida, Katsuyuki ^a   Kyuragi, Hakaru ^a  

^a NTT CORPORATION   (Japan)

^b NTT Advanced Technology Corporation   (Japan)

^c Hughes Aircraft Co   (United States)

Author keywords

CMP; CPW; damascene; EOS; gold electroplating; InP; millimeter wave; Si; UTC PD; wafer bonding

Indexed keywords

EID: 54249089240     PISSN: 13418939     EISSN: 13475525     Source Type: Journal    
DOI: 10.1541/ieejsmas.124.136     Document Type: Article

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