Technological fusion of heterogeneous functions

NTT R and D

Volumn 50, Issue 7, 2001, Pages 450-455

  Kyuragi, H ^a   Ishii, H ^a   Machida, K ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

DYNAMIC RANDOM ACCESS STORAGE; ELECTRONICS PACKAGING; LSI CIRCUITS; SUBSTRATES; ULSI CIRCUITS;

TECHNOLOGICAL FUSION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0034818777     PISSN: 09152326     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. SOP and SOC: The best of both
2. VLSIs in the year 2010 and beyond - From a designer's point of view
3. A measurement and simulation study of transmission on microstrip and stacked-pair structure for high speed signals
4. A new sensor structure and fabrication process for a single-chip fingerprint sensor/identifier LSI
5. A thick-Cu process for add-on interconnections using a low-k thick interlayer dielectric
6. Microfabrication technology for high-speed Si-based systems
7. A new fabrication process for low-loss millimeter-wave transmission lines on silicon
8. An electrostatic micromechanical switch for logic operation in multichip modules on Si
9. Ruthenium encapsulation of copper interconnections by selective electroless plating
10. Novel global planarization technology using SOG film transfer and hot-pressing