New sensor structure and fabrication process for a single-chip fingerprint sensor/identifier LSI

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 1999, Pages 887-890

  Machida, K ^a   Shigematsu, S ^a   Morimura, H ^a   Shimoyama, N ^a   Tanabe, Y ^a   Kumazaki, T ^a   Kudou, K ^a   Yano, M ^a   Kyuragi, H ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC DISCHARGES; ELECTRONIC DOCUMENT IDENTIFICATION SYSTEMS; FILMS; INTEGRATED CIRCUIT MANUFACTURE; LOGIC CIRCUITS; MECHANICAL TESTING; SENSORS; STRESSES;

ELECTROSTATIC DISCHARGE; SINGLE CHIP FINGERPRINT SENSOR IDENTIFIER LSI; WATER PENETRATION;

LSI CIRCUITS;

EID: 0033312241     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)