A thick-Cu process for add-on interconnections using photosensitive varnish for thick interlayer dielectric

Proceedings of the IEEE 2000 International Interconnect Technology Conference, IITC 2000

Volumn , Issue , 2000, Pages 123-125

  Saito, K ^a   Kosugi, T ^a   Yagi, S ^a   Yamaguchi, C ^a   Kudo, K ^b   Yano, M ^b   Kumazaki, T ^a   Yaita, M ^a   Ishii, H ^a   Machida, K ^a   Kyuragi, H ^a  

^a NTT CORPORATION   (Japan)

^b NTT Advanced Technology Corporation   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC FILMS; ELECTRIC INDUCTORS; ELECTROLESS PLATING; LIGHT SENSITIVE MATERIALS; PHOTOSENSITIVITY; SUBSTRATES; VARNISH;

CU INTERCONNECTIONS; FABRICATION PROCESS; HIGH QUALITY FACTORS; INTER-LAYER DIELECTRICS; INTERLAYER DIELECTRIC FILMS; MICROWAVE PASSIVES; NOVEL TECHNIQUES; SILICON SUBSTRATES;

COPPER;

EID: 84962916632     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2000.854300     Document Type: Conference Paper

References (7)

1. J. N. Burghartz, International Journal of RF and Microwave Computer-Aided Engineering, 8, 422 (1998).
2. J. Craninckx and M. S. J. Steyaert, IEEE J. Solid State Circuits, 32, 736 (1997).
3. H. B. Erzgräber, T. Grabolla, H. H. Richter, P. Schley, and A. Wolff, Technical Digests, IEEE International Electron Device Meeting (IEDM), 1998, pp. 535-539.
4. Y. Sun, H. van Zeijl, J. L. Tauritz, and R. G. F. Baets. Dig. International Microwave Symposium, 1996, pp 99-102.
5. J. B. Yoon, C. H. Han, E. Toon, and C. Kim, Technical Digests, IEEE International Electron Device Meeting (IEDM), 1999, pp. 753-756.
6. M. Yaita, A. Hirata, K. Machida, H. Ishii, K. Saito, N. Kawamura, and N. Awaya, Conference Proceedings USLI XIV, 1999, Materials Research Society, pp. 767-772.
7. M. Yaita, H. Ishii, K. Machida, K. Saito, and M. Maeda, Extended Abstracts (The 46th Spring Meeting, 1999), No. 2, p. 890. The Japan Society of Applied Physics and Related Societies (in Japanese).