A silicon test chip for the thermomechanical analysis of MEMS packagings

Microsystem Technologies

Volumn 15, Issue 1 SPEC. ISS., 2009, Pages 191-200

  Majcherek, Soeren ^a   Leneke, Thomas ^a   Hirsch, Soeren ^a  

^a OTTO VON GUERICKE UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; DIAPHRAGMS; ELECTRONIC EQUIPMENT MANUFACTURE; FINITE ELEMENT METHOD; MEMS; MICROELECTROMECHANICAL DEVICES; SENSOR NETWORKS; SENSORS; SILICON; STRESSES;

CONTACT PADS; FINITE ELEMENT ANALYSIS; GEOMETRIC PARAMETERS; HIGH PRECISIONS; INDUCED STRESSES; MECHANICAL AMPLIFIERS; MECHANICAL STRESSES; MEMS SENSORS; PACKAGING PROCESSES; PACKAGING TECHNOLOGIES; SILICON TESTS; SIMULATION RESULTS; SOLID STATES; STRESS EVALUATIONS; STRESS LOADS; STRESS SENSITIVES; THERMOMECHANICAL ANALYSES; TO PACKAGING;

ELECTRONICS PACKAGING;

EID: 54049130387     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-008-0655-7     Document Type: Conference Paper

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