Three-dimensional (3D) modeling of the thermoelastic behavior of woven glass fiber-reinforced resin matrix composites

Journal of Materials Science

Volumn 43, Issue 19, 2008, Pages 6468-6472

  Deng, X ^a,b   Chawla, N ^a  

^a AZ 85281   (United States)

^b KENNAMETAL INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; CARBON FIBER REINFORCED PLASTICS; COMPUTER SIMULATION; ELECTRONICS PACKAGING; FIBERS; GLASS; GLASS FIBERS; RESINS; THERMAL EXPANSION; THERMAL SPRAYING; THERMAL STRESS; THERMOELASTICITY; THREE DIMENSIONAL; WEAVING;

COMPLEX NATURES; COMPOSITE BEHAVIORS; ELASTIC PROPERTIES; ELECTRONIC PACKAGING; EXPANSION COEFFICIENTS; EXPERIMENTAL DATUM; MODELING; NUMERICAL SIMULATIONS; REINFORCED RESINS; WOVEN FIBERS; WOVEN GLASS FIBERS;

METALLIC MATRIX COMPOSITES;

EID: 54049106015     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-008-2982-6     Document Type: Article

References (26)

1. Kutz M (ed) (2002) Handbook of materials selection. Wiley, New York
2. JJ Glazer 1994 J Electron Mater 23 8 693 10.1007/BF02651361
3. EP Wood KL Nimmo 1994 J Electron Mater 23 709 10.1007/BF02651363
4. M Abtew G Selvardery 2000 Mater Sci Eng Rep 27 95 10.1016/S0927-796X(00) 00010-3
5. X Deng G Piotrowski JJ Williams N Chawla 2003 J Electron Mater 32 1403 10.1007/s11664-003-0108-0
6. CML Wu JKL Lai YL Wu 1998 Finite Elem Anal Des 30 19 10.1016/S0168- 874X(98)00028-6
7. SE Yamada 1987 Eng Fract Mech 27 315 10.1016/0013-7944(87)90149-4
8. JR Rice 1988 J Appl Mech Trans ASME 55 98
9. DJ Xie ZP Wang 1998 Finite Elem Anal Des 30 31 10.1016/S0168-874X(98) 00032-8
10. Darveaux R, Banerji K, Mawer A, Dody G (1995) In: Lau JH (ed) Ball grid array technology. McGraw-Hill, New York, p 379
11. Solomon HD (1994) In: Fear DR, Burchett SN, Morgan HS, Lau JH (eds) The mechanics of solder alloy interconnects. Van Norstrand Reinhold, New York, p 199
12. QJ Yang XQ Shi ZP Wang ZF Shi 2003 Finite Elem Anal Des 39 819 10.1016/S0168-874X(02)00134-8
13. Lau JH, Pao YH (1997) Solder joint reliability of BGA, CSP, flip chip, and fine pitch smt assemblies. McGraw-Hill, New York
14. Shi XQ, Zhou W, Pang HLJ, Wang ZP (1999) J Electron Packaging 121(3):179. doi: 10.1115/1.2792681
15. A Tabiei I Ivanov 2004 Int J Non-linear Mech 39 175 10.1016/S0020- 7462(02)00067-7
16. T Ishikawa TW Chou 1982 J Compos Mater 16 2 10.1177/002199838201600101
17. HT Hahn SW Tsai 1973 J Compos Mater 7 102
18. RA Naik 1995 J Compos Mater 29 2334
19. I Ivanov A Tabiei 2001 Compos Struct 54 4 489 10.1016/S0263-8223(01) 00121-0
20. OE Seifert SC Schumacher AC Hansen 2003 Compos Part B 34 571 10.1016/S1359-8368(03)00078-7
21. M Zako Y Uetsuji T Kurashiki 2003 Compos Sci Technol 63 507 10.1016/S0266-3538(02)00211-7
22. F Ellyin Z Xia Y Chen 2002 Compos Part A 33 399 10.1016/S1359-835X(01) 00112-9
23. N Chawla YK Tur JW Holmes JR Barber A Szweda 1998 J Am Ceram Soc 81 1221
24. SF Shuler JW Holmes X Wu D Roach 1993 J Am Ceram Soc 76 2327 10.1111/j.1151-2916.1993.tb07772.x
25. Chawla N, Chawla KK (2006) Metal matrix composites. Springer, New York
26. RA Schapery 1968 J Compos Mater 2 380 10.1177/002199836800200308