Process capability study and thermal fatigue life prediction of ceramic BGA solder joints

Finite Elements in Analysis and Design

Volumn 30, Issue 1-2, 1998, Pages 31-45

  Xie, D J ^a   Wang, Z P ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

BGA; Fatigue life prediction; FEM; Process capability; Solder joints

Indexed keywords

CERAMIC MATERIALS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; PROCESS ENGINEERING; SERVICE LIFE; THERMAL EFFECTS;

THERMAL FATIGUE;

SOLDERED JOINTS;

EID: 0032118032     PISSN: 0168874X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-874X(98)00032-8     Document Type: Article

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