Effect of annealing treatment conditions on the interfacial adhesion energy of electroless-plated Ni on polyimide

Korean Journal of Materials Research

Volumn 18, Issue 9, 2008, Pages 486-491

  Park, Sung Cheol ^a   Min, Kyoung Jin ^a   Lee, Kyu Hwan ^b   Jeong, Yongsoo ^b   Park, Young Bae ^a  

^a Andong National University   (South Korea)

^b Korea Institute of Material Science   (South Korea)

Author keywords

Adhesion; Annealing; Electroless plated Ni; Peel test; Polyimide

Indexed keywords

ADHESION; HEAT TREATMENT; INTERFACIAL ENERGY; NICKEL; NICKEL ALLOYS; OXYGEN; POLYIMIDES; POLYMERS;

AES ANALYSIS; AMBIENT CONDITIONS; AMBIENT ENVIRONMENTS; ANNEALING TREATMENTS; ELECTROLESS; ELECTROLESS-PLATED NI; INTERFACIAL ADHESION ENERGY; OXYGEN DIFFUSION; PEEL STRENGTH; PEEL TEST; PEEL TESTING; POLYIMIDE; POLYIMIDE STRUCTURES; POLYIMIDE SUBSTRATES; THERMAL TREATMENTS;

ANNEALING;

EID: 53749099774     PISSN: 12250562     EISSN: None     Source Type: Journal    
DOI: 10.3740/MRSK.2008.18.9.486     Document Type: Article

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