Effects of temperature/humidity treatments on the peel strength of CuCr alloy films on polyimide

Journal of Materials Science: Materials in Electronics

Volumn 7, Issue 3, 1996, Pages 175-179

  Ahn, E G ^a   Yu, Jin ^a   Park, I S ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATMOSPHERIC HUMIDITY; CHROMIUM; COPPER ALLOYS; DURABILITY; FAILURE (MECHANICAL); INTERFACES (MATERIALS); MECHANICAL TESTING; PEELING; POLYIMIDES; SPUTTER DEPOSITION; THERMAL EFFECTS;

PEEL STRENGTH; PEEL TEST;

THIN FILMS;

EID: 0030173636     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00133111     Document Type: Article

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