Design optimization of an integrated liquid-cooled IGBT power module using CFD technique

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 1, 2000, Pages 55-60

  Lee, Tien Yu ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIPOLAR TRANSISTORS; COMPUTATIONAL FLUID DYNAMICS; COOLING; GATES (TRANSISTOR); INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; OPTIMIZATION; THERMOANALYSIS;

INSULATED GATE BIPOLAR TRANSISTORS (IGBT);

POWER ELECTRONICS;

EID: 0033885650     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.833042     Document Type: Article

References (9)

1. G. Romero and J. Martinez, "Development of metal matrix composite baseplate technology for high current power modules," in Proc. Int. Symp. Microelectron., 1994, pp. 4214-26.
2. G. Romero, G.J. Fusaro, and J. Martinez, "Metal matrix composite power modules: Improvements in reliability and package integration," in Proc. Conf. Record 1995 IEEE Ind. Applicat. Soc., vol. I, pp. 916-922.
3. P. Rodriguez and J. Fusaro, "Integration of heat exchanger with high current hybrid power module," in Proc. Adv. Electron. Packag. 1997-Pacific Rim/ASME Int. Electron. Photon. Packag. Conf.-InterPak'97, vol. EEP-19-2, pp. 2173-2178.
4. Electronics System Cooling (ESC), a Product in IDEAS Master Series, IDEAS Master Series is a trademark of Structural Dynamics Research Corp., Milford, OH.
5. F P. Incropera and D.P. DeWitt, Fundamentals of Heat and Mass Transfer, 2nd ed. New York: Wiley, 1985.
6. R.J. Phillips, "MicroChannel heat sinks," in Advances in Thermal Modeling of Electronic Components and Systems, A. Bar-Cohen and A.D. Kraus, Eds. New York: ASME, 1990, vol. 2, ch. 3.
7. Flotherm® is a Computational Fluid Dynamics product registered by Flomerics Limited, Surrey, England.
8. Hi Contact™ Cold Plate is a Product of AAVID Thermal Technologies, Laconia, NH.
9. FC-72 is a perfluorocarbon liquid, a Product of 3M Co., St. Paul, MN.