Design and optimization of embedded power chip modules for double-sided cooling

Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)

Volumn 3, Issue , 2004, Pages 1545-1551

  Yin, Jian ^a   Van Wyk, J D ^a   Odendaal, W G ^a   Liang, Zhenxian ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ELECTRONICS PACKAGING; EMBEDDED SYSTEMS; ENCAPSULATION; HEATING; INSULATING MATERIALS; MOSFET DEVICES; THERMAL GRADIENTS; THERMOANALYSIS; THERMOELECTRICITY;

EMBEDDED POWER CHIP MODULES; POWER CHIPS; POWER DEVICES; POWER PACKAGING;

POWER ELECTRONICS;

EID: 10944250961     PISSN: 01972618     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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