Sol-gel-derived ZnO coating with nanopatterns fabricated by nanoimprinting

Journal of the American Ceramic Society

Volumn 91, Issue 10, 2008, Pages 3160-3166

  Kuan, Chi Yun ^a   Chou, Jaw Min ^b   Leu, Ing Chi ^c   Hon, Min Hsiung ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b I SHOU UNIVERSITY   (Taiwan)

^c NATIONAL UNITED UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

GELATION; GELS; METALLIC FILMS; MOLDS; PHOTORESISTS; SEMICONDUCTING ZINC COMPOUNDS; SOL-GEL PROCESS; SOL-GELS; SOLS; SOLVENTS; SURFACE RELAXATION; SURFACE ROUGHNESS; THICK FILMS; THIN FILMS; ZINC; ZINC ALLOYS; ZINC OXIDE;

APPLIED PRESSURE; DI-METHYLSILOXANE; GEL FILMS; IMPRINTING PROCESS; NANO SCALING; NANO-IMPRINTING; NANO-PATTERNS; PATTERN FORMATIONS; PATTERN TRANSFERRING; PRE TREATMENTS; PROCESSING CONDITIONS; PROCESSING PARAMETERS; SELF ASSEMBLING; SMOOTH SURFACES; SOL - GEL; ZNO FILMS;

COLLOIDS;

EID: 53349090237     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2008.02604.x     Document Type: Article

References (20)

1. S. Y. Chou, P. R. Krauss P. J. Renstrom Imprint of Sub-25 nm Vias and Trenches in Polymers Appl. Phys. Lett., 67 [21] 3114 6 (1995).
2. D. Y. Khang H. H. Lee Room-Temperature Imprint Lithography by Solvent Vapor Treatment Appl. Phys. Lett., 76 [7] 870 2 (2000).
3. L. Tan, Y. P. Kong, S. W. Pang A. F. Yee Imprinting of Polymer at Low Temperature and Pressure J. Vac. Sci. Technol. B., 25 [5] 2486 92 (2004).
4. 2 Gel Gratings for Optical Applications J. Vac. Sci. Technol. B., 21 [2] 660 3 (2003).
5. S. K. Donthu, Z. Pan, G. S. Shekhawat V. P. Dravid Near-Field Scanning Optical Microscopy of ZnO Nanopatterns Fabricated by Micromolding in Capillaries J. Appl. Phys., 98, 024304 (2005).
6. Y. Xia G. M. Whitesides Soft Lithography Annu. Rev. Mater. Sci., 28 [1] 153 84 (1998).
7. M. Ohyama, H. Kozuka T. Yoko Sol-gel Preparation of ZnO Films with Extremely Preferred Orientation Along (002) Plane from Zinc Acetate Solution Thin Solid Films, 306, 78 85 (1997).
8. R. R. Rye, G. C. Nelson M. T. Dugger Mechanistic Aspects of Alkylchlorosilane Coupling Reactions Langmuir, 13, 2965 72 (1997).
9. S. J. Kwon, J. H. Park J. G. Park Wrinkling of a Sol-Gel-Derived Thin Film Phys. Rev. E., 71, 011604 (2005).
10. C. J. Brinker G. W. Scherer, Sol-Gel Science: The Physics and Chemistry of Sol-Gel Processing, pp. 407 51. Academic, New York, 1990.
11. S. S. Sengupta, S. M. Park, D. A. Payne L. H. Allen Origins and Evolution of Stress Development in Sol-Gel Derived Thin Layers and Multideposited Coatings of Lead Titanate J. Appl. Phys., 83 [4] 2291 6 (1998).
12. P. J. Yoo, K. Y. Suh, S. Y. Park H. H. Lee Physical Self-Assembly of Microstructures by Anisotropic Buckling Adv. Mater., 14 [19] 1383 7 (2002).
13. C. Gourgon, J. H. Tortai, F. Lazzarino, C. Perret, G. Micouin O. Joubert Influence of Residual Solvent in Polymers Patterned by Nanoimprint Lithography J. Vac. Sci. Technol. B., 22 [2] 602 6 (2004).
14. M. Okinaka, S. I. Inoue, K. Tsukagoshi Y. Aoyagi Nonlinear Optical Polymer Patterned by Nanoimprint Lithography as a Photonic Crystal Waveguide Structure J. Vac. Sci. Technol. B., 24 [1] 271 3 (2006).
15. J. N. Lee, C. Park G. M. Whitesides Solvent Compatibility of Poly(dimethylsioxane)-Based Microfluidic Devices Anal. Chem., 75 [23] 6544 54 (2003).
16. E. Favre Swelling of Crosslinked Polydimethylsiloxane Networks by Pure Solvents: Influence of Temperature Eur. Polym. J., 32 [10] 1183 8 (1996).
17. R. C. Weast, Handbook of Chemistry and Physics, pp. E61 9. CRC Press., 1998.
18. U. Senthilkumar, R. Rajini B. S. R. Reddy Gas Permeation and Sorption Properties of Non-Ionic and Cationic Amino-Hydroxy Functionalized Poly(dimethylsiloxane) Membranes J. Membrane Sci., 254 [1-2] 169 77 (2005).
19. F. Lazzarino, C. Gourgon, P. Schiavone C. Perret Mold Deformation in Nanoimprint Lithography J. Vac. Sci. Technol. B., 22 [6] 3318 22 (2004).
20. H. S. Li, Y. C. Ding, Y. P. Tang, H. Z. Liu B. H. Lu Distortion Reduction by Load Release for Imprint Lithography Microelectron. Eng., 83 [3] 485 91 (2006).