Epoxy-based carbon films with high electrical conductivity attached to an alumina substrate

Carbon

Volumn 46, Issue 13, 2008, Pages 1798-1801

  Yamada, Yasuhiro ^a   Chung, D D L ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 52949132233     PISSN: 00086223     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.carbon.2008.07.001     Document Type: Letter

References (10)

1. Yamada Y, Chung DDL. Three-dimensional microstructuring of carbon by thermoplastic spacer evaporation during pyrolysis. Carbon, in press, doi:10.1016/j.carbon.2008.07.031.
2. Jeong O.C., and Konishi S. Three-dimensionally combinined carbonized polymer sensor and heater. Sens Actuators A 143 (2008) 97-105
3. Wang C., Taherabadi L., Jia G., Madou M., Yeh Y., and Dunn B. C-MEMS for the manufacture of 3D microbatteries. Electrochem Solid-State Lett 7 11 (2004) A435-A438
4. Lau K.H., and Li K.Y. Correlation between adhesion and wear behaviour of commercial carbon based coating. Tribol Int 39 (2006) 115-123
5. Park B.Y., Taherabadi L., Wang C., Zoval J., and Madou M.J. Electrical properties and shrinkage of carbonized photoresist films and implications for carbon microelectromechanical systems devices in conductive media. J Electrochem Soc 152 12 (2005) J136-J143
6. Hsu Y.C., and Chung D.D.L. Silver particle carbon-matrix composites as thick films for electrical applications. J Electron Mater 36 9 (2007) 1188-1192
7. Sebastien J., Arnaud B., Heinrich H., and Philippe R. SU8-silver photosensitive nanocomposite. Adv Eng Mater 6 9 (2004) 719-724
8. Singh A., Jayaram J., Madou M., and Akbar S. Pyrolysis of negative photoresists to fabricate carbon structures for microelectromechanical systems and electrochemical applications. J Electrochem Soc 149 3 (2002) E78-E83
9. Chalker P.R., Bull S.J., and Rickerby D.S. A review of the methods for the evaluation of coating-substrate adhesion. Mater Sci Eng A140 (1991) 583-592
10. Weast RC, Astle MJ. CRC handbook of chemistry and physics. Florida, USA: CRC Press, Inc.; 1978. p. F-170.