Low-temperature MEMS process using plasma activated Silicon-On-Silicon (SOS) bonding

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2007, Pages 309-312

  Galchev, Tzeno ^a   Welch III, Warren C ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COMPOSITE MICROMECHANICS; DIELECTRIC DEVICES; FABRICATION; MECHANICAL ENGINEERING; MECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; NONMETALS; OPTICAL DESIGN; PLASMAS; REACTIVE ION ETCHING; SEMICONDUCTOR SWITCHES; SILICA; SILICON COMPOUNDS; SURFACE TREATMENT; WAFER BONDING;

DIELECTRIC-BARRIER-DISCHARGE; ETCH PROFILE; HIGH ASPECT RATIOS; INTERNATIONAL CONFERENCES; LOW TEMPERATURES; LOW-TEMPERATURE WAFER BONDING; MEMS DEVICES; MEMS PROCESS; MEMS TECHNOLOGY; MICRO-ELECTRO MECHANICAL SYSTEMS; OPTIMAL BONDING; SILICON DIOXIDE LAYERS; SILICON-ON -INSULATOR; SILICON-ON-GLASS; SILICON-ON-SILICON; TREATMENT PROCESSES;

SILICON WAFERS;

EID: 52249104878     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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2. J. Chae, H. Kulah, and K. Najafi, "A hybrid Silicon-On-Glass (SOG) lateral micro-accelerometer with CMOS readout circuitry," in MEMS'02. Las Vegas, NV, 2002, pp. 623-626.
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5. T. Galchev, W. C. Welch III, and K. Najafi, "Silicon-On-Silicon (SOS): A New CMOS Compatible Low-Temperature MEMS Process Using Plasma Activated Fusion Bonding," presented at Solid-State Sensors, Actuators, and Microsystems Workshop (late news), Hilton Head, SC, 2006.
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