Reducing the electrodeposition time for filling microvias with copper for 3D technology

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 866-870

  Luhn O ^a,b   Radisic, A ^a   Vereecken, P M ^a   Swinnen, B ^a   Van Hoof, C ^a,b   Ruythooren, W ^a   Celis, J P ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; CONCENTRATION (PROCESS); METALLIZING; SELF ASSEMBLED MONOLAYERS; TANTALUM; THREE DIMENSIONAL;

TOP SURFACE; VOID-FREE;

COPPER;

EID: 51349168311     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550078     Document Type: Conference Paper

References (12)

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