Coupling noise analysis and high frequency design optimization of power/ground plane stack-up in embedded chip substrate cavities

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1874-1879

  Sankaran, Nithya ^a   Ramdas, Venkatesh Chelukka ^c   Lee, Baik Woo ^a   Sundaram, Venky ^a   Engin, Ege ^a   Iyer, Mahadevan ^b   Swaminathan, Madhavan ^a   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Infineon Technologies Asia Pacific

^c SAMEER Centre for Electromagnetics India   (India)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; DISTRIBUTED PARAMETER NETWORKS; DISTRIBUTION OF GOODS; ELECTRIC SIGNAL SYSTEMS; OPTIMIZATION; SIGNAL SYSTEMS;

COUPLING NOISE; ELECTRONIC COMPONENTS; POWER INTEGRITY;

QUALITY ASSURANCE;

EID: 51349150844     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550237     Document Type: Conference Paper

References (8)

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4. Ostmann, A.; Neumann, A.; Weser, S.; Jung, E.; Bottcher, L.; Reichl, H., "Realization of a stackable package using chip in polymer technology". Polymers and Adhesives in Microelectronics and Photonics, 2nd International IEEE Conference on 23-26 June 2002 Page(s):160 - 164.
5. Baik-Woo Lee, Venky Sundaram, Boyd Wiedenman, Chong K Yoon, Mahadevan Iyer and Rao R Tummala, "Chip-last Embedded Active for System-On-Package (SOP)", 2007 Electronic Components and Technology Conference, Reno, May 2007.
6. Nithya Sankaran, Baik-Woo Lee, Venky Sundaram, Ege Engin, Mahadevan Iyer, Madhavan Swaminathan and Rao Tummala, "Electrical Characterization and Design Optimization of Embedded Chip in Substrate Cavities", 2007 Electronic Components and Technology Conference, Reno, May 30-June 2 (2007)
7. J. Lee, Y. M. Seng, M. K. Iyer, and J. Kim, "Investigation of plane-to-plane noise coupling through cutout in multilayer power/ground planes," in Proc. 4th Electronics Packaging Technology Conf, Singapore, Dec. 2002, pp. 257-260.
8. Junwoo Lee, Student Member, IEEE, Mihai Dragos Rotaru, Member, IEEE, Mahadevan K. Iyer, Senior Member, IEEE, Hyungsoo Kim, and Joungho Kim, "Analysis and Suppression of SSN Noise Coupling Between Power/Ground Plane Cavities Through Cutouts in Multilayer Packages and PCBs", IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 28, NO. 2, MAY 2005.