Investigation of plane-to-plane noise coupling through cutout in multi-layer power/ground planes

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 257-260

  Lee, Junwoo ^a   Seng, Yeo Mui ^b   Iyer, M K ^b   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS ENGINEERING; ELECTRONICS INDUSTRY;

GOOD CORRELATIONS; NOISE COUPLING; SWITCHING CURRENTS; TRANSFER IMPEDANCE;

ELECTRONICS PACKAGING;

EID: 84964595998     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2002.1185678     Document Type: Conference Paper

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