Characterization and reliability verification of wafer-level hermetic package with nano-liter cavity for RF-MEMS applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1127-1134

  Ham, Suk Jin ^a   Jeong, Byung Gil ^a   Lim, Ji Hyuk ^a   Jung, Kyu Dong ^a   Baek, Kae Dong ^a   Kim, Woon Bae ^a   Moon, Chang Youl ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; MEMS; RELIABILITY ANALYSIS; THERMAL CYCLING;

HERMETIC PACKAGING; PERFORMANCE EVALUATION; WAFER LEVEL PACKAGING;

WSI CIRCUITS;

EID: 35348821786     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373937     Document Type: Conference Paper

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