Wafer level thin film encapsulation for BAW RF MEMS

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 605-609

  Pornin, J L ^a   Gillot, C ^a   Parat, G ^a   Jacquet, F ^a   Lagoutte, E ^a   Sillon, N ^a   Poupon, G ^a   Dumont, F ^b  

^a CEA LETI   (France)

^b ST   (France)

Author keywords

[No Author keywords available]

Indexed keywords

NATURAL FREQUENCIES; PIEZOELECTRIC DEVICES; THIN FILMS; WAVE FILTERS;

BULK ACOUSTIC WAVE; DIELECTRIC LAYER; ELECTRIC RESONATORS; PLASTIC ENCAPSULATION; WAFER GRINDING;

MEMS;

EID: 35348820509     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373858     Document Type: Conference Paper

References (4)

1. K. Najafi, "Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS", Micromachining and Microfabrication Process Technology VII, Proc. Of SPIE Vol. 4979, 2003.
2. B.H. Starck, K. Najafi, "A Low-Temperature Thin-Film Electroplated Metal Vacuum Package", Journal of Microelectromechanical Systems, Vol. 13, No. 2, pp. 147-157, April, 2004.
3. M. Bartek, J.A. Foerster, R.F. Wolffenbuttel, "Vacuum sealing of microcavities using metal evaporation", Sensors and Actuators, A61, pp. 364-368, 1997.
4. C. Gillot, J.L. Pornin, A. Arnaud, E. Lagoutte, N. Sillon, J.C. Souriau "Wafer Level Thin Film Encapsulation for MEMS" EPTC SingaporeDecember 2005