Package substrate built-in three-dimensional distributed matching circuit for high-speed SerDes applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 676-682

  Oikawa, Ryuichi ^a  

^a RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC COMPOUNDS; CMOS INTEGRATED CIRCUITS; COMPUTER NETWORKS; SPEED; TECHNOLOGY; THREE DIMENSIONAL; TIMING JITTER;

ELECTRONIC COMPONENTS; HIGH SPEEDS; MATCHING CIRCUITS;

SUBSTRATES;

EID: 51349096646     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550045     Document Type: Conference Paper

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