Embedded chip build-up using fine line interconnect

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 49-53

  Fillion, Ray ^a   Woychik, Charles ^a   Zhang, Tan ^a   Bitting, Don ^a  

^a GENERAL ELECTRIC COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP CARRIER; EMBEDDED CHIP; MICRO-VIAS; SEMICONDUCTOR INDUSTRY;

ELECTRONICS INDUSTRY; EMBEDDED SYSTEMS; OPTICAL INTERCONNECTS; SEMICONDUCTOR DEVICE MANUFACTURE; SHRINKAGE; TRANSISTORS;

MICROPROCESSOR CHIPS;

EID: 35348812505     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373775     Document Type: Conference Paper

References (6)

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2. th Pan Pacific Microelectronics Symposium, Maui, HI, Jan. 2007.
3. Neumann, A. et al, "Reliability Tests of a Stackable 3-D Package," Proc. 14th European Microelectronics and Packaging Conference, June 2003, pp 352-357.
4. th Pan Pacific Microelectronics Symposium, Maui, HI, Jan. 2007.
5. Daum, W. et al, "High-G Multichip Modules for Defense Systems Using HDI," Proc. International Society of Hybrid Microelectronics Conference, Boston MA, Nov. 1994, pp. 232-236.
6. th European Microelectronics Packaging Conderence, Brugge Belgium, June 2005.