Discontinuity cancellation to boost package bandwidth up to material's limitations - 40 Gbps package design using wire-bonded PBGA

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 224-231

  Kam, Dong Gun ^a,b   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Discontinuity cancellation; High speed link; Package electrical design; Plastic ball grid array (PBGA)

Indexed keywords

BANDWIDTH MEASUREMENTS; DISCONTINUITY CANCELLATION; ELECTRICAL DESIGN; FULL-WAVE SIMULATIONS; HIGH-SPEED LINKS; PACKAGING SOLUTIONS; PLASTIC BALL GRID ARRAYS; TIME DOMAIN REFLECTOMETRY;

MICROELECTRONICS; WIRE;

DESIGN;

EID: 84876913972     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. J. Kim, et al., "Circuit techniques for a 40Gb/s transmitter in 0.13-um CMOS," Proc. IEEE International Solid-State Circuits Conference, 2005, pp. 150-151.
2. S. Chickamenahalli, et al., "RF packaging and passives: design, fabrication, measurement, and validation of package embedded inductors," IEEE Transactions on Advanced Packaging, Vol. 28, No. 4, 2005, pp. 665-673.
3. D. Kam, et al., "Packaging a 40-Gbps serial link using a wire-bonded plastic ball grid array," IEEE Design & Test of Computers, Vol. 23, No. 3, 2006, pp. 212-219.
4. H. Johnson and M. Graham, "High-speed signal propagation - advanced black magic", Prentice Hall PTR, 2003, pp. 341-343.
5. S. Ahn, et al., "Compensation of ESD and input capacitance effect by using package bondwire inductance for over Gbps differential SerDes devices," Proc. Electrical Performance of Electronic Packaging, 2003, pp. 159-162.
6. D. Kam, et al., "Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission," IEEE Transactions on Advanced Packaging, Vol. 27, No. 4, 2004, pp. 590-596.