Processing, properties and electrical reliability of embedded ultra-thin film ceramic capacitors in organic packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1014-1018

  Abothu, Isaac Robin ^a   Markondeya Raj, P ^a   Hwang, Jin Hyun ^a   Kumar, Manish ^a   Iyer, Mahadevan ^a   Yamamoto, Hiroshi ^b   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b NGK/NTK Spark Plug Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; DIELECTRIC PROPERTIES; FERROELECTRIC THIN FILMS; MICROSTRUCTURE; RELIABILITY; SOL-GEL PROCESS;

CERAMIC THICK FILMS; DC LEAKAGE CHARACTERISTICS; DECOUPLING APPLICATIONS; ELECTRICAL RELIABILITY; EMBEDDED DECOUPLING CAPACITOR; ORGANIC PACKAGES;

THICK FILMS;

EID: 35348854335     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373921     Document Type: Conference Paper

References (7)

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