Package performance improvement with counter-discontinuity and its effective bandwidth

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2007, Pages 163-166

  Na, Nju ^a   Bailey, Mark ^a   Kalantarian, Asad ^b  

^a IBM   (United States)

^b Massachusetts Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D SIMULATIONS; EFFECTIVE BANDWIDTHS; HIGH SPEEDS; PACKAGE DESIGNS; PACKAGE PERFORMANCES; SIMULATION EXAMPLES; SOLDER BALLS; TARGET FREQUENCIES; TO PACKAGES; TRANSMISSION LINE BEHAVIORS;

BRAZING; ELECTRONICS PACKAGING; MARINE BIOLOGY; PHASE INTERFACES; TELECOMMUNICATION SYSTEMS; THREE DIMENSIONAL COMPUTER GRAPHICS; WELDING;

SOLDERING;

EID: 47949097594     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2007.4387150     Document Type: Conference Paper

References (4)

1. th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 107-110, Austin, Texas, Oct. 24-26, 2005.
2. th Electronic Components and Technology Conference, pp. 147.153, Reno, NV, May 29-June 1, 2007.
3. Steven Voldman, ESD: RF Technology and Circuits, Chichester, England: John Willey and Sons, Inc., 2006.
4. David M. Pozar, Microwave Engineering, John Willey and Sons, Inc., 1998.