Why is copper locally etched by scanning electrochemical microscopy?

Journal of Electroanalytical Chemistry

Volumn 622, Issue 1, 2008, Pages 115-120

  Sheffer, Marisa ^a   Mandler, Daniel ^a  

^a HEBREW UNIVERSITY OF JERUSALEM   (Israel)

Author keywords

Cu; Etching; Microelectrode; Scanning electrochemical microscopy; Thin films

Indexed keywords

CHARGE TRANSFER; CHEMICAL REACTIONS; CONCENTRATION (PROCESS); COPPER PLATING; DISSOLUTION; ION EXCHANGE; METAL RECOVERY; METALLIC FILMS; MICROSCOPIC EXAMINATION; SCANNING; SCANNING ELECTRON MICROSCOPY; SCANNING PROBE MICROSCOPY; SURFACE DIFFUSION; SURFACE REACTIONS;

CU; ETCHING; MICROELECTRODE; SCANNING ELECTROCHEMICAL MICROSCOPY; THIN FILMS;

COPPER;

EID: 51349096361     PISSN: 15726657     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jelechem.2008.05.005     Document Type: Article

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