Comparison of analysis methods for package-induced stresses on moulded Hall sensors

Microsystem Technologies

Volumn 12, Issue 10-11, 2006, Pages 1005-1009

  Fischer, Sebastian ^a   Beyer, Harald ^b   Janke, Ralf ^b   Hartwig, Stefan ^a   Wilde, Jürgen ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b Micronas GmbH Freiburg   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; GEOMETRY; HALL EFFECT; MECHANICAL PROPERTIES; PIEZOELECTRIC DEVICES; THERMAL EFFECTS; THERMAL EXPANSION;

MECHANICAL STRESS; PIEZO-HALL EFFECTS; TEMPERATURE-DEPENDENT MATERIAL;

SEMICONDUCTOR MATERIALS;

EID: 33747589190     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-006-0128-9     Document Type: Conference Paper

References (5)

1. Deier E, Wilde J (2000) Thermo-mechanical behaviour of the die attachment adhesive of a MEMS pressure sensor. In: 14th European microelectronics and packaging conference and exhibition, 23-25 June 2000, Friedrichshafen, Germany
2. Fischer S, Beyer H, Janke R, Wilde J (2005) The influence of package-induced stresses on moulded Hall sensors. Microsyst Technol 12:69-74
3. Hälg B (1988) Piezo-Hall coefficients of n-type silicon. J Appl Phys 64:276-282
4. Iancu OT (1989) Berechnung von thermischen Eigenspannungs-feldern in Keramik/Metall-Verbunden, VDI Fortschritt Berichte, Reihe 18, Nr. 74. VDI Verlag,
5. Manic D, Petr J, Popovic RS (2000) Short and long-term stability of Hall plates in plastic packages. In: IEEE, 38th international reliability physics symposium 2000, San Jose, California, pp 225-230