Finite element and Moiré interferometry study of chip capacitor reliability

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1687-1694

  Lin, S T ^a   Han, B ^b   Suhling, J C ^c   Johnson, R W ^c   Evans, J L ^d  

^a UNITED TECHNOLOGIES RESEARCH CENTER   (United States)

^b Clemson University   (United States)

^c AUBURN UNIVERSITY   (United States)

^d Chrysler Huntsville Electronics   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 5844348088     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (15)

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2. Bergenthal, J. and Prymak, J. D., 1994, "Capacitance Monitoring While Flex Testing," Proceedings of the 44th Electronic Components and Technology Conference, IEEE, pp.854-860.
3. EIA-J RC 3402, 1983, Multilayer Ceramic Capacitors (Chip Type).
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9. Pao, Y.-H., Jih, E., Siddapureddy, V., Song, X., Liu, R., McMillan, R., and Hu, J. M., 1996, "A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints," Sensing, Modeling and Simulation in Emerging Electronic Packaging, ASME, EEP-Vol. 17, pp. 1-12.
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