Adhesion characterization of no-flow underfills used in flip chip assemblies and correlation with reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 343-347

  Lu, Jicun ^a   Smith, Brian ^a   Baldwin, Daniel F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CONDUCTIVE PLASTICS; CRACK PROPAGATION; DELAMINATION; FAILURE (MECHANICAL); FLIP CHIP DEVICES; RELIABILITY; SEMICONDUCTING SILICON COMPOUNDS; STRENGTH OF MATERIALS;

NO FLOW UNDERFILL MATERIALS; SHEAR TEST VEHICLE ASSEMBLIES; THERMAL SHOCK RELIABILITY TEST;

ELECTRONICS PACKAGING;

EID: 0034483002     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)