Thermal and mechanical behaviors of underfills for flip-chip packaging

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 842-847

  Huang, Shuang Wu ^a   Chia, Yong Poo ^a   Low, Siu Waf ^a   Wong, Mee Mee ^b  

^a MICRON TECHNOLOGY INC   (United States)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION (CTE); METAL BUMPS; SHEAR TEST; WAFER-LEVEL PACKAGING (WLP);

DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; FLIP CHIP DEVICES; SCANNING ELECTRON MICROSCOPY; SILICA; STRESS ANALYSIS; THERMAL EXPANSION;

ELECTRONICS PACKAGING;

EID: 33847307528     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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