Automatic full strain field moiŕ interferometry measurement with nano-scale resolution

Experimental Mechanics

Volumn 48, Issue 5, 2008, Pages 665-673

  Chen, B ^a   Basaran, C ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Automatic moir interferometry; Continuous wavelet transform; Electronic packaging; Phase shifting; Solder joint reliability

Indexed keywords

CONTINUOUS WAVELET TRANSFORM; ELECTRONIC PACKAGING; PHASE SHIFTING; SOLDER JOINT RELIABILITY; STRAIN FIELDS;

COMPUTER NETWORKS; COPYING; ELECTRIC CURRENTS; ELECTRONICS PACKAGING; GEODETIC SATELLITES; INTERFEROMETERS; INTERFEROMETRY; PIXELS; RELIABILITY ANALYSIS; TENSORS; WAVELET TRANSFORMS;

FINITE ELEMENT METHOD;

EID: 51249121987     PISSN: 00144851     EISSN: 17412765     Source Type: Journal    
DOI: 10.1007/s11340-008-9127-3     Document Type: Article

References (26)

1. Post D, Han B, Ifju P (1994) High sensitivity moiré: Experimental analysis for mechanics and materials. Springer, New York.
2. Han B (1998) Recent advancements of moiré and microscopic moiré interferometry for thermal deformation analyses of microelectronics devices. Exp Mech 38:278-288.
3. Morita Y, Arakawa K, Todo M (2007) High-sensitivity measurement of thermal deformation in a stacked multichip package. IEEE Trans Compon Packag Technol 30:137-143.
4. Han B, Kunthong P (2000) Micro-mechanical deformation analysis of surface laminar circuit in organic flip-chip package: An experimental study. Transactions of the ASME. J Electron Packag 122:294-300.
5. Guo Y, Lim CK, Chen WT, Woychik CG (1993) Solder ball connect (SBC) assemblies under thermal loading. I. Deformation measurement via moiré interferometry, and its interpretation. IBM J Res Develop 37:635-647.
6. Walker CA (2004) Handbook of moiré measurement. Institute of Physics Pub, Bristol.
7. Zhao Y, Basaran C, Cartwright A, Dishongh T (2000) Thermomechanical behavior of micron scale solder joints under dynamic loads. Mech Mater 32:161-173.
8. He X, Zou D, Liu S, Guo Y (1998) Phase-shifting analysis in Moiré interferometry and its applications in electronic packaging. Opt Eng 37:1410-1419.
9. Yamamoto Y, Morimoto Y, Fujigaki M (2007) Two-directional phase-shifting Moiré interferometry and its application to thermal deformation measurement of an electronic device. Meas Sci Technol 18:561-566.
10. Loewen EG, Popov E (1997) Diffraction gratings and applications. Marcel Dekker, New York.
11. Liu H (2003) Phase reconstruction of phase shifted moiré interferograms using continuous wavelet transforms. State University of New York at Buffalo, New York, USA.
12. Liu H, Cartwright AN, Basaran C (2004) Experimental verification of improvement of phase shifting Moiré interferometry using wavelet-based image processing. Opt Eng 43:1206-1214.
13. Sciammarella CA, Taeeeui K (2003) Determination of strains from fringe patterns using space-frequency representations. Opt Eng 42:3182-3193.
14. Cordero RR, Molimard J, Martinez A, Labbe F (2007) Uncertainty analysis of temporal phase-stepping algorithms for interferometry. Opt Commun 275:144-155.
15. Guo H, Zhao Z, Chen M (2007) Efficient iterative algorithm for phase-shifting interferometry. Opt Lasers Eng 45:281-292.
16. Liu H, Cartwright AN, Basaran C (2004) Moiré interferogram phase extraction: A ridge detection algorithm for continuous wavelet transforms. Appl Opt 43:850-857.
17. Watkins LR (2007) Phase recovery from fringe patterns using the continuous wavelet transform. Opt Lasers Eng 45:298-303.
18. Sciammarella CA, Kim T (2005) Frequency modulation interpretation of fringes and computation of strains. Exp Mech V45:393-403.
19. Afifi M, Fassi-Fihri A, Marjane M, Nassim K, Sidki M, Rachafi S (2002) Paul wavelet-based algorithm for optical phase distribution evaluation. Opt Commun 211:47-51.
20. Vetterli M, Kovacevic J (1995) Wavelets and subband coding. Prentice-Hall, Englewood Cliffs, New Jersey, 07632.
21. Zhao Y (2001) Thermomechanical behavior of ball grid array solder joints under thermal and vibration loading: Testing and modeling. State University of New York at Buffalo, Buffalo, NY.
22. Han B, Post D, Ifju P (2001) Moiréinterferometry for engineering mechanics: Current practices and future developments. J Strain Anal Eng Des 36:101-116.
23. Liu H, Cartwright AN, Basaran C (2003) Sensitivity improvement in phase-shifted moiré interferometry using 1-D continuous wavelet transform image processing. Opt Eng 42:2646-2652.
24. Han B, Post D (1992) Immersion interferometer for microscopic moiré interferometry. Exp Mech 32:38-41.
25. Liou NS, Prakash V (2000) Moiré microscope for finite deformation micro-mechanical studies. Exp Mech 40:351-360.
26. Hua Y, Basaran C, Hopkins D (2003) Thermomigration in Pb-Sn solder joints under joule heating during electric current stressing. Appl Phys Lett 82:1045-1047.