Characteristics of leakage current in the dielectric layer due to Cu migration during bias temperature stress

Journal of Applied Physics

Volumn 104, Issue 4, 2008, Pages

  Hwang, Sang Soo ^a   Jung, Sung Yup ^a   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC FIELD EFFECTS; ELECTRIC FIELDS; HEAT CONDUCTION; HEAVY IONS; MECHANISMS; METAL INSULATOR BOUNDARIES; MIS DEVICES; OPTICAL INTERCONNECTS; THREE DIMENSIONAL;

APPLIED BIAS; BIAS TEMPERATURE STRESS; CU-ION MIGRATION; FIELD APPLICATIONS;

LEAKAGE CURRENTS;

EID: 50849117478     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2973154     Document Type: Article

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