A physical model of time-dependent dielectric breakdown in copper metallization

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2003, Pages 282-286

  Wu, Wen ^a   Duan, Xiaodong ^b   Yuan, J S ^a  

^a UNIVERSITY OF CENTRAL FLORIDA   (United States)

^b Avanex Corporation   (United States)

Author keywords

"E" model; Copper diffusion; Copper metallization; Reliability; TDDB lifetime

Indexed keywords

COPPER; DIFFUSION; METALLIZING; STRESS ANALYSIS; THERMAL EFFECTS;

TIME-DEPENDENT DIELECTRIC BREAKDOWN (TDDB);

ELECTRIC BREAKDOWN;

EID: 0038310066     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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