Effect of surface contamination on solid-state bondability of Sn-Ag-Cu bumps in ambient air

Materials Transactions

Volumn 49, Issue 7, 2008, Pages 1508-1512

  Wang, Ying Hui ^a   Suga, Tadatomo ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

Surface activated bonding; Surface contamination; Thermocompression bonding; Tin silver copper bump

Indexed keywords

ARGON; COPPER; METAL CLADDING; MOLECULAR ORBITALS; MOLECULAR SPECTROSCOPY; PHOTOELECTRON SPECTROSCOPY; PLASMAS; SHEAR STRENGTH; SILVER; SILVER ALLOYS; SOLDERED JOINTS; STRENGTH OF MATERIALS; TIN; TIN ALLOYS;

SURFACE ACTIVATED BONDING; SURFACE CONTAMINATION; SURFACE CONTAMINATIONS; THERMOCOMPRESSION BONDING; TIN-SILVER-COPPER BUMP;

X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 50549089533     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MF200804     Document Type: Article

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