Low temperature fluxless flip chip technology for fine pitch bonding

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 24-28

  Davoine, C ^a   Fendler, M ^a   Marion, F ^a   Louis, C ^a   Fortunier, R ^a,b  

^a CEA GRENOBLE   (France)

^b Center Microelectronics De Provence Georges Charpak   (France)

Author keywords

[No Author keywords available]

Indexed keywords

FINE PITCH BONDING; FLUXLESS TECHNOLOGY;

ADHESIVES; BONDING; ELECTRIC CONDUCTANCE; FLUXES; PLASMA ETCHING; THERMAL EFFECTS;

FLIP CHIP DEVICES;

EID: 33845570898     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645621     Document Type: Conference Paper

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