Emerging technologies for wireless handsets

SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference Proceedings

Volumn , Issue , 2007, Pages 770-777

  Pacheco, Sergio ^a   Keser, Beth ^a   Liu, Lianjun ^a   Abrokwah, Jon ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

Front end module; Integrated passives; Redistributed chip packaging; Rf mems

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER NETWORKS; ELECTROMAGNETIC WAVES; ELECTRONIC EQUIPMENT MANUFACTURE; MICROWAVES; PHOTONICS; SEMICONDUCTOR DEVICES; TELEPHONE SETS;

FRONT-END MODULE; INTEGRATED PASSIVES; REDISTRIBUTED CHIP PACKAGING; RF MEMS;

ELECTRONICS PACKAGING;

EID: 50449088495     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMOC.2007.4404373     Document Type: Conference Paper

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