Thermal fatigue mechanisms of CSP solder joints on PWB

NEC Research and Development

Volumn 44, Issue 3, 2003, Pages 246-250

  Ohta, Hironori ^a   Nishimura, Nozomu ^a  

^a NONE

Author keywords

CSP (Chip Scale Packages); EBSP (Electron BackScatter diffraction Pattern); Lead free solder; Thermal fatigue

Indexed keywords

BACKSCATTERING; FATIGUE OF MATERIALS; PATTERN MATCHING; SOLDERED JOINTS; THERMOANALYSIS;

LEAD FREE SOLDERING;

CHIP SCALE PACKAGES;

EID: 0041817637     PISSN: 0547051X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (2)

1. Saeki, et al., "Influence of Cu core in solder balls on organization and strength of BGA joints using electroless Ni/Au plated pads," Electronics Packaging Society Record, 4, 4, pp.306-311, 2001.
2. Kariya, et al., "Structure and mechanical reliability of electroless Ni-P/Sn-Ag lead-free solder joint interface," 32nd Micro-jointing Research Committee meeting materials, pp.1-8, 2001.