Effect of ramp rate on microstructure and properties of thermomechanically-fatigued Sn-3.5Ag based composite solder joints

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2006, Pages

  Liu, Peng ^a   Gao, Yuan ^a   Cao, Qian ^a   Xia, Zhidong ^a   Lei, Yongping ^a   Guo, Fu ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ENVIRONMENTAL CHAMBERS; FATIGUE OF MATERIALS; MICROSTRUCTURE; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT; TIN ALLOYS;

COEFFICIENT OF THERMAL EXPANSION (CTE); LEAD-FREE COMPOSITES; MECHANICALLY MIXING; RAMP RATE; THERMOMECHANICAL FATIGUE (TMF) TESTS;

SOLDERED JOINTS;

EID: 34948891452     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359742     Document Type: Conference Paper

References (10)

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10. J. Lee "Effect of dwell times on thermomechanical fatigue behavior of Sn-Ag-based solder joints," J. Electron. Mater, 31, (9), 2002, pp. 946-952.