Aluminum/diamond composites and their applications in electronic packaging

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages

  Tong, Zhensong ^a   Shen, Zhuoshen ^a   Zhang, Yujuan ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM; DIAMONDS; ELECTRONICS PACKAGING; INFILTRATION; LIGHT METALS; OPTICAL DESIGN; SEEPAGE; SOIL MECHANICS; TECHNOLOGY;

ALUMINUM MATRIX COMPOSITES; ELECTRONIC PACKAGING; FABRICATION METHODS; GAS PRESSURE INFILTRATION; INTERFACE REACTION; INTERNATIONAL CONFERENCES; SQUEEZE CASTING;

METALLIC MATRIX COMPOSITES;

EID: 50249130668     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2007.4441446     Document Type: Conference Paper

References (46)

1. A. H. Kumar, R. R. Tummala, "The past, present, and future of multilayer ceramic multichip modules in electronic packaging", JOM, Vol. 44, No. 7 (1992), pp. 10-14
2. R. D. Rossi, "Multichip modules: an overview of design, materials, and processes", Surface mount technology, Vol. 4, No. 8, (1990), pp. 17-20
3. R. R. Tummala, "Ceramic and glass-ceramic packaging in the 1990s", J. Am. Ceram. Soc., Vol. 74, No. 5, (1991), pp. 895-908
4. W. R. Hamburgen and J. R. Fitch, "Packaging a 150W bipolar ECL microprocessor", 42nd Electronic Components and Technology Conference, IEEE, San Diego, CA, USA, May. 1992, pp. 412-422
5. Q. Sun, 0. T. Inal, "Fabrication and characterization of diamond/copper composites for thermal management substrate applications", Materials science and engineering, Vol. B41, No. 2 (1996), pp. 261-266
6. H. L. Davidson, N. J. Colella, J. A. Kerns, D. Makowiecki, "Copper-diamond composite substrates for electronic components", 45th Electronic Components and Technology Conference, IEEE, Las Vegas, NV, USA, May. 1995, pp. 538-541
7. C. Zweben, "Metal-matrix composites for electronic packaging", JOM, Vol. 44, No. 7 (1992), pp. 15-23
8. W. B. Johnson, B. Sonuparlak, "Diamond/Al metal matrix composites formed by the pressureless metal infiltration process", Journal of material research, Vol. 8, No. 5 (1993), pp. 1169-1173
9. R. M. German, K. F. Hens and J. L. Johnson, "Powder metallurgy processing of thermal management materials for microelectronic applications", International Journal of Powder Metallurgy, Vol. 30, No. 2 (1994), pp. 205-215
10. D. L. Ellis , D. L. McDanels, "Thermal conductivity and thermal expansion of graphite fiber-reinforced copper matrix composites", Metallurgical Transactions A, Vol. 13, No. 4 (1993), pp. 43-52
11. R. Chanchani, P. M. Hall, "Temperature dependence of thermal expansion of ceramics and metals for electronic packages", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 13, No. 4 (1990), pp. 743-750
12. Y. L. Shen, A. Needleman and S. Suresh, "Coefficients of thermal expansion of metal-matrix composites for electronic packaging", Metallurgical Transactions A, Vol. 25, No. 4 (1994), pp. 839-850
13. C. Zweben, "Overview of advanced composites for thermal management", 4th international symposium on advanced packaging materials: processes, properties and interfaces, IEEE, Braselton, GA, USA, March. 1998, pp. 183-197
14. C. Zweben, "Advanced materials for optoelectronic packaging", Electronic packaging and production, Vol. 42, No. 9 (2002), pp. 37-40
15. C. Zweben, "Advanced composites and other advanced materials for electronic packaging thermal management", Proceedings of international symposium and exhibition on advanced packaging materials processes, properties and interfaces, Braselton, GA, March. 2001, pp. 360-365
16. C. Zweben, "Emerging Low Cost LED Thermal Management Materials", Fourth International Conference on Solid State Lighting, Denver, CO, US, Aug. 2004, pp. 194-206
17. C. Zweben, "New material options for high-power diode laser packaging", Proceedings of SPIE, High-Power Diode Laser Technology and Applications II, San Jose, CA, US, Jan. 2004, pp. 166-75
18. C. Zweben, "New material options for light-emitting diode packaging", Proceedings of SPIE, Light-Emitting Diodes: Research, Manufacturing, and Applications VIII, San Jose, CA, US, Jan. 2004, pp. 173-82
19. C. Zweben, "New, low-CTE, ultrahigh-thermal-conductivity materials for lidar laser diode packaging", Proceedings of SPIE, Lidar Remote Sensing for Environmental Monitoring VI, San Diego, CA, US, Aug. 2005, pp. 1-10
20. C. Zweben, "Recent advances in photonics packaging materials", Proceedings of SPIE,, Photonics Packaging and Integration VI, San Jose, CA, US, Jan. 2006, pp. 61260J1-11
21. K. Hanada, M. Mayuzumi, N. Nakayama, T. Sano, "Processing and characterization of cluster diamond dispersed Al-Si-Cu-Mg composite", Journal of materials processing technology, Vol. 119, No. 1-3 (2001), pp. 216 221
22. B. Maruyama, R.K. Everett, A. Morrish, P. Natishan, P. Pehrsson, A.E. Edelstein, L.S. Cook, in: A.R. Bunsell, J.F. Jamet, A. Massiah (Eds.), Developments in Science and Technology of Composite Materials, European Association for Composite Materials, Elsevier, (Amsterdam, 1992), pp. 715
23. P. M. Natishan, R. K. Everett, J. W. Glesener, P. E. Pehrsson, B. Maruyama, A. S. Edelstein, et al, "Electrochemical behavior of diamond-reinforced composites", Materials Science & Engineering, Vol. A197, No. 1 (1995), pp. 79-81
24. W. B. Johnson and B. Sonuparlak, "Diamond/Al metal matrix composites formed by the pressureless metal infiltration process", Journal of materials research, Vol. 8, No. 5 (1993), pp. 1169-1173
25. F. A. Khalid, O. Beffort, U. E. Klotz, B. A. Keller, P. Gasser, "Microstructure and interfacial characteristics of aluminium-diamond composite materials", Diamond and related materials, Vol. 13, No. 10 (2004), pp. 393-400
26. O. Beffort, S. Vaucher, F. A. Khalid, "On the thermal and chemical stability of diamond during processing of Al/diamond composites by liquid metal infiltration (squeeze casting)", Diamond and related materials, Vol. 13, No. 10 (2004), pp. 1834-1843
27. S. M. Pickard, J. C. Withers, R. Loutfy, "Squeeze cast composites for thermal management of power electronic devices". International SAMPE technical conference, Long Beach, CA, US, May. 2004, pp. 4033-4045
28. O. Beffort, F. A. Khalid, L. Weber, P. Ruch, U. E. Klotz, S. Meier, S. Kleiner, "Interface formation in infiltrated Al(Si)/diamond composites", Diamond and related materials, Vol. 15, No. 9 (2006), pp. 1250-1260
29. P. W. Ruch, O. Beffort, S. Kleiner, L. Weber, P. J. Uggowitzer, "Selective interfacial bonding in Al(Si)-diamond composites and its effect on thermal conductivity", Composites science and technology, Vol. 66, No. 15 (2006), pp. 2677-2685
30. S. Tanaka, L. S. Lee, K. Hokamoto, "Synthesis of Al-SiCp and Al-diamond composites through dynamic compaction using underwater shock wave", Proceedings of the ASME Pressure Vessels and Piping Conference 2005 - Fluid-Structure Interaction, PVP2005, Denver, CO, US, Jul. 2005, pp. 139-144
31. K. Landry, S. Kalogeropoulou, N. Eustathopoulos, "Wettability of carbon by aluminum and aluminum alloys", Materials science and engineering, Vol. A254, No. 1-2 (1998) pp. 99-111
32. N. Eustathopoulos, M. G. Nicholas, B. Drevet, Wettability at high temperatures, Elsevier science, (Amsterdam, 1999), pp. 325-328
33. D. P. H. Hasselman, L. F. Johnson, "Effective thermal conductivity of composites with interfacial thermal barrier resistance", Journal of composite materials, Vol. 21, No. 6 (1987), pp. 508-515
34. K. Chihiro, Aluminum/diamond composite material and its manufacture, JP Patent, JP2000303126, 2000. 10. 31
35. K. Yoshida, H. Morigami, "Thermal properties of diamond/copper composite material", Microelectronics reliability, Vol. 44, No. 2 (2004), pp. 303-308
36. F. Delanay, Comprehensive composite materials, Elsevier Science Ltd., (Amsterdam, 2000), pp. 341.
37. K. C. Uspenskaya, U. N. Tormashev, D. V. Fedoceev, "Oxidization and graphitization of diamond in condition of low pressure atmosphere", Journal of physics and chemistry, Vol. 56, No. 2 (1982), pp. 495-496 (in Russian)
38. O. N. Breusov, V. N. Drobishev, G. E. Ivanchihina, et al, Effect of high temperature vacuum annealing on properties of detonation synthetic diamond, In: Proceedings of international Symposium on physicochemical properties of Ultra-hard Materials, Academy of science, (Kiev, 1987), pp. 48-53.
39. D. V. Fedoseev, V. L. Buhovets, S. P. Vnukov, et al, Graphitization of diamond at high temperatures, surfacial and thermo-physical properties of diamond, In: Proceedings of international symposium on physicochemical properties of ultra-hard materials, Academy of science, (Kiev, 1985), pp. 6-9
40. D. V. Fedoseev, V. L. Buhovets, S. P. Vnukov, et al, "Surfacial graphitization of diamond at high temperatures", Surface, Vol. 1 (1980), pp. 92-99 (in Russian)
41. T. Evans, In: J.E. Field (Ed.), The properties of diamond, Academic Press, (London, 1979), pp. 403-424
42. J.E. Field, In: J.E. Field (Ed.), The properties of natural and synthetic diamond, Academic Press, (London, 1992), pp. 672-673.
43. P.E. Pehrsson, T.W. Mercer, J.A. Chaney, "Thermal oxidation of the hydrogenated diamond (100) surface", Surface science, Vol. 497, No. 1-3 (2002), pp. 13-28
44. S. Welz, Y. Gogotsi, M.J. McNallan, "Nucleation, growth, and graphitization of diamond nanocrystals during chlorination of carbides", Journal of applied physics, Vol. 93, No. 7 (2003), pp. 4207 4214
45. G. Meaden, P. G. Partridge, E. Nicholson, et al, "Diamond fibre metal matrix composites", Diamond and related materials, Vol. 6, No. 5-7 (1997), pp. 898-901
46. P.G. Partridge, G.Lu, P. May, et al, "Potential high-strength high thermal conductivity metal-matrix composites based on diamond fibres", Diamond and related materials, Vol. 4, No. 5-6 (1995), pp. 848-851