New material options for high-power diode laser packaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5336, Issue , 2004, Pages 166-175

  Zweben, Carl ^a  

^a Adv Packaging Materials Consultant   (United States)

Author keywords

Carbon; Coefficient of thermal expansion; Composites; Graphite; High power laser diodes; Laser diodes; Manufacturing; Materials; Packaging; Thermal conductivity; Thermal management; Thermal stresses

Indexed keywords

CARBON; COMPOSITE MATERIALS; COSTS; GRAPHITE; MANUFACTURE; MATERIALS; MICROPROCESSOR CHIPS; PACKAGING; PROBLEM SOLVING; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMAL STRESS;

COEFFICIENT OF THERMAL EXPANSION; HIGH-POWER LASER DIODES; THERMAL DESIGN; THERMAL MANAGEMENT;

SEMICONDUCTOR LASERS;

EID: 3543109092     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.529177     Document Type: Conference Paper

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