New material options for light-emitting diode packaging

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5366, Issue , 2004, Pages 173-182

  Zweben, Carl ^a  

^a Adv Packaging Materials Consultant   (United States)

Author keywords

Carbon; Coefficient of thermal expansion; Composites; Graphite; Light emitting diodes; Manufacturing; Materials; Packaging; Thermal conductivity; Thermal management; Thermal stresses

Indexed keywords

ALLOYS; CARBONACEOUS ADSORBENTS; CERAMIC MATERIALS; CHIP SCALE PACKAGES; COMPOSITE MATERIALS; PACKAGING; POLYMERS; SEMICONDUCTOR MATERIALS; THERMAL CONDUCTIVITY; THERMAL STRESS;

LOW-CTE MATERIALS; PACKAGING THERMAL MANAGEMENT; POWER CONVERSION EFFICIENCY; POWER LEVELS;

LIGHT EMITTING DIODES;

EID: 3543124079     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.529192     Document Type: Conference Paper

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