Crack and delamination risk evaluation of thin silicon based microelectronics devices

11th International Conference on Fracture 2005, ICF11

Volumn 5, Issue , 2005, Pages 3775-3779

  Auersperg, J ^a,b   Vogel, D ^a   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

^b AMIC Angewandte Micro Messtechnik GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AFM; CONSUMER GOODS; DESIGN OPTIMIZATION; EXPERIMENTAL INVESTIGATIONS; INHOMOGENEITIES; INTERFACE DELAMINATION; MANUFACTURING PROCESS; MECHANICAL PROBLEMS; METALLIC STRUCTURES; MIXED-MODE INTERFACE; MODE MIXITY; NONLINEAR FINITE ELEMENT SIMULATION; NOVEL SOLUTIONS; NUMERICAL INVESTIGATIONS; PAPER-LIKE; PARAMETERIZED MODELING; RATE DEPENDENT; RISK EVALUATION; SILICON DIE; SILICON-BASED; SOLDER INTERCONNECTS; SPECIFIC AREAS; SYSTEM INTEGRATION; TEXTILE MATERIALS;

FRACTURE; FRACTURE MECHANICS; MICROELECTRONICS; SILICON;

DELAMINATION;

EID: 84869791566     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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2. Ostmann, A., Neumann, A., Auersperg, J., Ghahremain, C., Sommer, G., Aschenbrenner, R., Reichl, H., "Integration of Passive and Active Components into Build-Up Layers", 4th Electronics Packaging Technology Conference (EPTC 2002), 10-12 Dezember, Singapur, 2002
3. Liu, Sh., Mei, Y., Wu, T. Y., "Bimaterial Interfacial Crack Growth as a Function of Mode-Mixity", IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A. Vol. 18 No. 3, Sept., pp. 618-626, 1995
4. Wang, J., Lu, M., Ren, W., Zou, D., Liu, Sh., "A Study of the Mixed-Mode Interfacial Fracture Toughness of Adhesive Joints Using a Multiaxial Fatigue Tester", IEEE Trans. of Electronics Packaging Manufacturing, Vol. 22 No. 2, April, pp. 166-173, 1999
5. Brust, F. W., Atluri, S. N., "Studies on Creep Crack Growth using the T*-Integral", Engng. Fract. Mech., 23 (1986)3, pp. 551-574, 1986
6. Brust, F. W., Nishioka, T., Atluri, S. N., Nakagaki, M., "Further Studies on Elastic-Plastic Stable Fracture Utilizing the T*- Integral", Engng. Fract. Mech., 23 (1986)3, pp. 551-574, 1986
7. Sun, C. T., Qian, W., "The Use of Finite Extension Strain Energy Release Rates in Fracture of Interfacial Cracks", Int. J. Solids Structures Vol. 34. No. 20, pp. 2595-2609
8. Hutchinson, J. W., "Mixed mode fracture mechanics of interfaces, metal-ceramic interface", Acta Scripta Metallurgica 4, pp. 295-306
9. Rybicki, E. F., Kanninen, M. F., "A finite element calculation of stress intensity factors by a modified crack closure integral", Eng. Fracture Mechanics Vol. 9, pp. 931-938
10. Auersperg, J., Kieselstein, E., Schubert, A., Michel, B. "Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches", Trans. of the ASME, J. of Electronic Packaging Vol. 124, Dec., pp. 318-322, 2002