A study of the mixed-mode interfacial fracture toughness of adhesive joints using a multiaxial fatigue tester

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 2, 1999, Pages 166-173

  Wang, Jianjun ^b   Lu, Minfu ^b   Ren, Wei ^b   Zou, Daqing ^a   Liu, Sheng ^a,b  

^a IEEE   (United States)

^b WAYNE STATE UNIVERSITY   (United States)

Author keywords

Adhesive joints; Energy release rate; Finite element analysis; Interfacial fracture toughness; Moir interferometry; Multiaxial fatigue tester; Phase angle

Indexed keywords

LASER MOIRE INTERFEROMETERS; MIXED-MODE INTERFACIAL FRACTURE TOUGHNESS; MULTIAXIAL FATIGUE TESTERS;

ADHESIVE JOINTS; COMPUTATIONAL METHODS; CRACK PROPAGATION; FATIGUE TESTING; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); INTERFEROMETERS; LASER APPLICATIONS;

ELECTRONICS PACKAGING;

EID: 0033333719     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.778177     Document Type: Article

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