Effects of process parameters on bondability in ultrasonic ball bonding

Scripta Materialia

Volumn 54, Issue 2, 2006, Pages 293-297

  Qi, Jun ^a   Hung, Ngar Chun ^a   Li, Ming ^a   Liu, Deming ^a  

^a ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

Plastic deformation; Slip; Ultrasonic bonding

Indexed keywords

INTERFACES (MATERIALS); PLASTIC DEFORMATION; ULTRASONIC DEVICES;

BONDABILITY; SLIP; ULTRASONIC BONDING;

BONDING;

EID: 27644492834     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2005.07.042     Document Type: Article

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