Thermoelectric measurements for bondability analysis of bond pads: A new concept for a bondability analyzer

Surface and Interface Analysis

Volumn 28, Issue 1, 1999, Pages 191-194

  Groning P ^a   Schwaller, P ^a   Schneuwly, A ^a   Schlapbach, L ^a  

^a UNIVERSITY OF FRIBOURG   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; HEAT LOSSES; THERMOCOUPLES; THERMOELECTRICITY; ULTRASONIC APPLICATIONS;

BONDABILITY; ULTRASONIC WIRE BONDING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0344642593     PISSN: 01422421     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1096-9918(199908)28:1<191::AID-SIA605>3.0.CO;2-#     Document Type: Article

References (5)

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4. V. P. Jaecklin, Assem. Packag. 95, 208 (1995).
5. A. Carras and V. P. Jaecklin, Dtsch. Verb. Schweisstech. 173, 135 (1995).