Nanoscale indentation behavior of pseudo-elastic Ti-Ni thin films

Journal of Alloys and Compounds

Volumn 465, Issue 1-2, 2008, Pages 491-496

  Cao, Xiaohua ^a   Cao, Xiaoling ^b,c   Zhang, Qing ^d  

^a ZHEJIANG NORMAL UNIVERSITY   (China)

^b SHANGHAI JIAO TONG UNIVERSITY   (China)

^c ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^d Guangdong Polytechnic College ^*  (China)

Author keywords

Nanoindentation test; Phase transformation; Pseudo elasticity; Ti Ni thin film

Indexed keywords

AMORPHOUS MATERIALS; ANNEALING; DIFFERENTIAL SCANNING CALORIMETRY; LASER INTERFEROMETRY; MAGNETRON SPUTTERING; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; NICKEL; NICKEL ALLOYS; SOLIDS; THICK FILMS; THIN FILMS; VAPOR DEPOSITION;

ANNEALING TEMPERATURE; AS-DEPOSITED; DIFFERENTIAL SCANNING CALORIMETRY (DSC); NANOINDENTATION TEST; NANOINDENTION; NANOSCALE INDENTATIONS; PARENT PHASE; PHASE TRANSFORMATION; POST-ANNEALING; PSEUDO-ELASTICITY; TI-NI THIN FILM; X-RAY DIFFRACTOMETER;

AMORPHOUS FILMS;

EID: 50149112032     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2007.10.118     Document Type: Article

References (21)

1. Fu Y.Q., Du H., Huang W., Zhang S., and Hu M. Sens. Actuators A-Phys. 112 (2004) 395
2. Fu Y.Q., Huang W., Du H., Huang X., Tan J., and Gao X. Surf. Coat. Technol. 145 (2001) 107
3. Ishida A., Sato M., and Miyazaki S. Mater. Sci. Eng. A 273-275 (1999) 754
4. Miyazaki S., and Ishida A. Mater. Sci. Eng. A 273-275 (1999) 106
5. Komvopoulos K., and Ma X.-G. Appl. Phys. Lett. 87 (2005) 1-3
6. Ma X.-G., and Komvopoulos K. Appl. Phys. Lett. 83 (2003) 3773-3775
7. Shaw G.A., Stone D.S., Johnson A.D., Ellis A.B., and Crone W.C. Appl. Phys. Lett. 83 (2003) 257-259
8. Poilane C., Delobelle P., Lexcellent C., Hayashi S., and Tobush0i H. Thin Solid Films 379 (2000) 156-165
9. Gall K., Juntunen K., Maier H.J., Sehitoglu H., and Chumlyakov Y.I. Acta Mater. 49 (2001) 3205-3217
10. Liu R., Li D.Y., Xie Y.S., Llewellyn R., and Hawthorne H.M. Scripta Mater. 41 (1999) 691-696
11. Wangyang Ni, Yang-Tse Cheng, David S., and Grummon. Appl. Phys. Lett. 82 (2003) 2811-2813
12. Patrick Surbled, Catherine Clerc, Bruno Le Pioufle, Manabu Ataka, and Hiroyuki Fujita. Thin Solid Films 401 (2001) 52-59
13. Jason L., Woolman K.P., Mohanchandra, Gergory P., and Carman. Proc. SPIE 5053 (2003) 230-238
14. Otsuka K., and Ren X. Physical metallurgy of Ti-Ni-based shape memory alloys. Prog. Mater. Sci. 50 (2005) 511-678
15. Zhang J., Cai W., Ren X., Otsuka K., and Asai M. Mater. Trans. JIM 40 (1999) 1367-1375
16. Ishida A., and Miyazaki S. J. Eng. Mater. Technol. 121 (1999) 2-8
17. Giannakopoulos A.E., and Suresh S. Scripta Mater. 40 (1999) 1191-1198
18. Beegan D., Chowdhury S., and Laugier M.T. Surf. Coat. Technol. 192 (2005) 57-63
19. Moyne S., Poilane C., Kitamura K., Miyazaki S., Delobelle P., and Lexcellent C. Mater. Sci. Eng. A 273-275 (1999) 727-732
20. Zhang L., Xie C., and Wu J. J. Alloys Compd. 427 (2007) 238-243
21. Zhou M., Nose M., Makino Y., and Nogi K. Thin Solid Films 359 (2000) 165-170