Work of indentation methods for determining copper film hardness

Surface and Coatings Technology

Volumn 192, Issue 1, 2005, Pages 57-63

  Beegan, D ^a   Chowdhury, S ^a   Laugier, Michael T ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

B Atomic force microscopy (AFM); B Nanoindentation; D Copper

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; INDENTATION; MICROHARDNESS; SILICON; SPUTTERING; THERMOOXIDATION; VOLUME MEASUREMENT;

COPPER FILMS; INDENTATION HARDNESS; PHARR METHOD; SILICON SUBSTRATES;

THIN FILMS;

HARDNESS;

EID: 11444265209     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2004.02.003     Document Type: Article

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