Microvia fill ratio control

IEEE International Symposium on Industrial Electronics

Volumn , Issue , 2007, Pages 153-156

  Tenno, Robert ^a   Pohjoranta, Antti ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CELL GROWTH; CURRENT DENSITY; INDUSTRIAL ELECTRONICS; OPTIMIZATION; TECHNICAL PRESENTATIONS; VOLTAGE REGULATORS;

ACCURATE PREDICTION; CELL VOLTAGES; CONTROL LAWS; DEPOSIT GROWTH; GALVANOSTAT; INTERNATIONAL SYMPOSIUM; LINEAR GROWTH; MICROVIA; NON-LINEAR CONTROL; POTENTIOSTAT; PROCESS-OPTIMIZATION; RATIO CONTROL; SET POINTS; VIA FILL;

ELECTRONICS INDUSTRY;

EID: 50049097563     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISIE.2007.4374590     Document Type: Conference Paper

References (10)

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2. Pohjoranta A. and Tenno R., "A method for microvia fill process modelling in a Cu-Cu-electrode system with electrolyte additives," unpublished.
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10. Josell D. and Wheeler D. and Huber W.H. and Bonevich J.E. and Moffat T.P., "A Simple Equation for Predicting Superconformal Deposition in Submicrometer Trenches, J. El. chem. Soc, vol. 148, no. 12, pp.C767-C773, 2001.