Wafer level temporary bonding/debonding for thin wafer handling applications

IMAPS International Conference and Exhibition on Device Packaging - Co-located with the Global Business Council, GBC 2006 Spring Conference

Volumn , Issue , 2006, Pages

  De Munck, Koen ^a   Bogaerts, Lieve ^a   Tezcan, Deniz S ^a   De Moor, Piet ^a   Swinnen, Bart ^a   Baert, Kris ^a   Van Hoof, Chris ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84877079081     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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2. Proc. of the 1st and 2nd conf. on "3D Architectures for Semiconductor Integration and packaging,", RTI international, Burlingame, California, April 13-15, 2004 and Tempe, Arizona, June 13-15, 2005
3. E. Beyne, "3D Interconnection and packaging: impending reality or still a dream?," proceedings of the IEEE International Solid-State Circuits Conference, ISSCC2004, 15-19 February 2004; San Francisco, CA, USA, IEEE, 2004, pp. 138-145.
4. Phil Garrou, "3D Integration: A status report", proceedings "3D Architectures for Semiconductor Integration and packaging,", RTI international, Burlingame, Tempe, Arizona, June 13-15, 2005.
5. M. Reiche, G. Wagner, "Wafer Thinning: Techniques for Ultra-thin Wafers,", Advanced Packaging, March 2003
6. MATECH, http://www.matech.com/thinning/thinning.html
7. Savastiouk, S., Siniaguine, O., Hammond, M., "Atmospheric Downstream Plasma - a new tool for semiconductor processing,", Solid State Technology, June, 1998.
8. S. Keilbach, www.protec-process-systems.de/news/ Thin%20Semicinductor%20Device%20Workshop%202003.pdf
9. Source: http://www.hoyaoptics.com/specialty-glass/silicon-glass-bonding. htm
10. http://www.emsdiasum.com/microscopy/products/materials/adhesives.aspx
11. http://www.testbourne.com/pages/samplepreparation/consumables/wax.htm
12. http://www.promerus.com